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Gan, Z. and Gusak, A. M. and Shao, W. and Chen, Z. and Mhaisalkar, S.G. and Zaporozhets, T. and Tu, K. N. (2007) Analytical modeling of reservoir effect on electromigration in Cu interconnects. Journal of Materials Research, Т. 22 (№ 1). pp. 152-158.
Suh, J. O. and Tu, K. N. and Lutsenko, G. V. and Gusak, A. M. (2007) Size distribution and morphology of Cu6Sn5 scallops in wetting reaction between molten solder and copper. Acta Materialia Inc.. pp. 1075-1083.