Елементи, в яких автор: "Tu, K. N."

Hung-Che, L., Shih-Chi, L., Jia-Juen, O., Dinh-Phuc, T., Gusak, A. M., Tu, K. N., Chih, C. (2022) Evolution of interfacial voids in Cu-to-Cu joints. Materials Characterization, 190. с. 2-11.

Liu, Y., Гусак, А. М., Jing, S., Tu, K. N. (2022) Fast prediction of electromigration lifetime with modified mean-time-to-failure equation. Materials Letters, 325. с. 1-3.

Tu, K. N., Gusak, A. M. (2019) A unified model of mean-time-to-failure for electromigration, thermomigration, and stress-migration based on entropy production. Journal of Applied Physics (№ 126). с. 1-19.

Tang, W., Picraux, S. T., Huang, J. Yu, Gusak, A. M., Tu, K. N., Dayeh, S. A. (2013) Nucleation and Atomic Layer Reaction in Nickel Silicide for DefectEngineered Si Nanochannels. American Chemical Society. Nano Letters (№ 13). с. 2748-2753.

Turlo, V. V., Gusak, A. M., Tu, K. N. (2012) Model of phase separation and of morphology evolution in two-phase alloy. Philosophical Magazine. с. 1-13.

Tian, T., Gusak, A. M., Liashenko, O.Yu., Han, J.-K., Choi, D., Tu, K. N. (2012) A New Physical Model for Life Time Prediction of Pb-free Solder Joints in Electromigration Tests. IEEE. с. 741-746.

Kovalchuk, A. O., Gusak, A. M., Tu, K. N. (2010) Theory of Repeating Nucleation in Point Contact Reactions between Nanowires. Nano Letters. с. 4799-4806.

Gusak, A. M., Tu, K. N. (2009) Interaction between the Kirkendall effect and the inverse Kirkendall Effect In Nanoscale Particles. Acta Materialia (№ 57). с. 3367-3373.

Suh, J. O., Tu, K. N., Lutsenko, G. V., Lutsenko, G. V. (2008) Size distributi on and morphology of Cu6Sn5 scallops in wetting reaction between molten solder and copper. Acta Materialia. с. 1-9.

Gan, Z., Gusak, A. M., Shao, W., Chen, Z., Mhaisalkar, S.G., Zaporozhets, T., Tu, K. N. (2007) Analytical modeling of reservoir effect on electromigration in Cu interconnects. Journal of Materials Research, Т. 22 (№ 1). с. 152-158.

Suh, J. O., Tu, K. N., Lutsenko, G. V., Gusak, A. M. (2007) Size distribution and morphology of Cu6Sn5 scallops in wetting reaction between molten solder and copper. Acta Materialia Inc.. с. 1075-1083.

Ouyang, Fan-Yi, Tu, K. N., Lai, Yi-Shao, Gusak, A. M. (2006) Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration. Applied Physics LEtters. с. 89-91.

Gusak, A. M., Zaporozhets, T. V., Tu, K. N., Gosele, U. (2005) Kinetic analysis of the instability of hollow nanoparticles. Philosophical Magazine, Т. 85 (№ 36). с. 4445-4464.

Gusak, A. M., Lutsenko, G. V., Tu, K. N. (2005) Ostwald ripening with non-equilibrium vacancies. Acta Materialia. с. 1-7.

Vairagara, A. V., Krishnamoorthy, A., Tu, K. N., Gusak, A. M., Meyer, M. A. M., Zschech, E., Mhaisalkar, S. G., Zschech, E. (2004) In situ observation of electromigration-induced void migration in dual-damascene Cu interconnect structures. Applied physics letters, Т. 85 (№ 13). с. 2502-2505.

Tu, K. N., Gusak, A. M., Sobchenko, I. (2003) Linear rate of grain growth in thin films during deposition. Physical review (№ 67). с. 1-5.

Tu, K. N., Gusak, A. M., Li, M. (2003) Physics and materials challenges for lead-free solders. American Institute of Physics, Т. 93 (№ 3). с. 1335-1353.

Gusak, A. M., Tu, K. N. (2003) Theory of normal grain growth in normalized size space. Acta Materialia (№ 51). с. 3895-3904.

Gusak, A. M., Tu, K. N. (2002) Kinetic theory of flux-driven ripening. Physical Review (№ 66). с. 1-14.