Physics and materials challenges for lead-free solders

Tu, K. N. and Gusak, A. M. and Li, M. (2003) Physics and materials challenges for lead-free solders. American Institute of Physics, Т. 93 (№ 3). pp. 1335-1353.

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Abstract

At present, the electronic industry is actively searching for Pb-free solders due to environmental concerns over Pb-containing solders. Solder joints are widely used to bond chips to their substrates for electrical connection and packaging. Lacking reliability data, many electronic companies will be reluctant to adopt Pb-free solders in the advanced products. Hence, it is timely to review our understanding of structure-property relationship and potential reliability issues of Pb-free solders. A brief history of solder joint processes in electronic manufacturing is presented to serve as a background for the review. It emphasizes the unique phenomenon of spalling of interfacial intermetallic compound in solder reactions. Challenges for Pb-free solders from the point of view of physics and materials are given since the reliability issues of solder joints will remain with us when advanced Cu/low k dielectric interconnect technology is introduced into microelectronic devices.

Item Type: Article
Subjects: Фізико-математичні науки
Divisions: Навчально-науковий інститут інформаційних та освітніх технологій
Depositing User: Наукова Бібліотека
Date Deposited: 11 Jun 2020 11:53
Last Modified: 11 Jun 2020 11:53
URI: http://eprints.cdu.edu.ua/id/eprint/3704

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