Items where Author is "Tu, K. N."

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Number of items: 16.

Article

Tu, K. N. and Gusak, A. M. (2019) A unified model of mean-time-to-failure for electromigration, thermomigration, and stress-migration based on entropy production. Journal of Applied Physics (№ 126). pp. 1-19.

Tang, W. and Picraux, S. T. and Huang, J. Yu and Gusak, A. M. and Tu, K. N. and Dayeh, S. A. (2013) Nucleation and Atomic Layer Reaction in Nickel Silicide for DefectEngineered Si Nanochannels. Nano Letters (№ 13). pp. 2748-2753.

Turlo, V. V. and Gusak, A. M. and Tu, K. N. (2012) Model of phase separation and of morphology evolution in two-phase alloy. Philosophical Magazine. pp. 1-13.

Kovalchuk, A. O. and Gusak, A. M. and Tu, K. N. (2010) Theory of Repeating Nucleation in Point Contact Reactions between Nanowires. Nano Letters. pp. 4799-4806.

Gusak, A. M. and Tu, K. N. (2009) Interaction between the Kirkendall effect and the inverse Kirkendall Effect In Nanoscale Particles. Acta Materialia (№ 57). pp. 3367-3373.

Suh, J. O. and Tu, K. N. and Lutsenko, G. V. and Lutsenko, G. V. (2008) Size distributi on and morphology of Cu6Sn5 scallops in wetting reaction between molten solder and copper. Acta Materialia. pp. 1-9.

Gan, Z. and Gusak, A. M. and Shao, W. and Chen, Z. and Mhaisalkar, S.G. and Zaporozhets, T. and Tu, K. N. (2007) Analytical modeling of reservoir effect on electromigration in Cu interconnects. Journal of Materials Research, Т. 22 (№ 1). pp. 152-158.

Suh, J. O. and Tu, K. N. and Lutsenko, G. V. and Gusak, A. M. (2007) Size distribution and morphology of Cu6Sn5 scallops in wetting reaction between molten solder and copper. Acta Materialia Inc.. pp. 1075-1083.

Ouyang, Fan-Yi and Tu, K. N. and Lai, Yi-Shao and Gusak, A. M. (2006) Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration. Applied Physics LEtters. pp. 89-91.

Gusak, A. M. and Zaporozhets, T. V. and Tu, K. N. and Gosele, U. (2005) Kinetic analysis of the instability of hollow nanoparticles. Philosophical Magazine, Т. 85 (№ 36). pp. 4445-4464.

Gusak, A. M. and Lutsenko, G. V. and Tu, K. N. (2005) Ostwald ripening with non-equilibrium vacancies. Acta Materialia. pp. 1-7.

Vairagara, A. V. and Krishnamoorthy, A. and Tu, K. N. and Gusak, A. M. and Meyer, M. A. M. and Zschech, E. and Mhaisalkar, S. G. and Zschech, Ehrenfried (2004) In situ observation of electromigration-induced void migration in dual-damascene Cu interconnect structures. Applied physics letters, Т. 85 (№ 13). pp. 2502-2505.

Tu, K. N. and Gusak, A. M. and Sobchenko, I. (2003) Linear rate of grain growth in thin films during deposition. Physical review (№ 67). pp. 1-5.

Tu, K. N. and Gusak, A. M. and Li, M. (2003) Physics and materials challenges for lead-free solders. American Institute of Physics, Т. 93 (№ 3). pp. 1335-1353.

Gusak, A. M. and Tu, K. N. (2003) Theory of normal grain growth in normalized size space. Acta Materialia (№ 51). pp. 3895-3904.

Gusak, A. M. and Tu, K. N. (2002) Kinetic theory of flux-driven ripening. Physical Review (№ 66). pp. 1-14.

This list was generated on Fri Nov 27 13:20:05 2020 EET.