Up a level |
Tu, K. N. and Gusak, A. M. and Li, M. (2003) Physics and materials challenges for lead-free solders. American Institute of Physics, Т. 93 (№ 3). pp. 1335-1353.
Tu, K. N. and Gusak, A. M. and Sobchenko, I. (2003) Linear rate of grain growth in thin films during deposition. Physical review (№ 67). pp. 1-5.