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Vairagar, A. V. and Mhaisalkar, S. G. and Meyer, M. A. and Krishnamoorthy, A. and Zschech, E and Gusak, A. M. (2005) Direct evidence of electromigration failure mechanism in dual-damascene Cu interconnect tree structures. Applied physics letters, Т. 87 (№ 1). pp. 1-3.
Vairagara, A. V. and Krishnamoorthy, A. and Tu, K. N. and Gusak, A. M. and Meyer, M. A. M. and Zschech, E. and Mhaisalkar, S. G. and Zschech, E. (2004) In situ observation of electromigration-induced void migration in dual-damascene Cu interconnect structures. Applied physics letters, Т. 85 (№ 13). pp. 2502-2505.