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Goh, C. F. and Gan, Z. H. and Mhaisalkar, S. G. and Boey, F. Y. C. and Gusak, A. M. and Teo, P. S. (2006) Modeling of smoothening effect on morphologies of annealed submicron nickel particles used for electrically conductive adhesives. American Institute of Physics (№ 100). pp. 1-5.