Items where Author is "Mhaisalkar, S. G."

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Article

Goh, C. F. and Gan, Z. H. and Mhaisalkar, S. G. and Boey, F. Y. C. and Gusak, A. M. and Teo, P. S. (2006) Modeling of smoothening effect on morphologies of annealed submicron nickel particles used for electrically conductive adhesives. American Institute of Physics (№ 100). pp. 1-5.

Vairagar, A. V. and Mhaisalkar, S. G. and Meyer, M. A. and Krishnamoorthy, A. and Zschech, E and Gusak, A. M. (2005) Direct evidence of electromigration failure mechanism in dual-damascene Cu interconnect tree structures. Applied physics letters, Т. 87 (№ 1). pp. 1-3.

Vairagara, A. V. and Krishnamoorthy, A. and Tu, K. N. and Gusak, A. M. and Meyer, M. A. M. and Zschech, E. and Mhaisalkar, S. G. and Zschech, E. (2004) In situ observation of electromigration-induced void migration in dual-damascene Cu interconnect structures. Applied physics letters, Т. 85 (№ 13). pp. 2502-2505.

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