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Goh, C. F. and Gan, Z. H. and Mhaisalkar, S. G. and Boey, F. Y. C. and Gusak, A. M. and Teo, P. S. (2006) Modeling of smoothening effect on morphologies of annealed submicron nickel particles used for electrically conductive adhesives. American Institute of Physics (№ 100). pp. 1-5.
Lyashenko, Yu. A. and Gusak, A. M. (2006) DIGM - Entropy balance and free energy release rate. Defect and Diffusion Forum, Т. 249. pp. 81-90.
Ouyang, Fan-Yi and Tu, K. N. and Lai, Yi-Shao and Gusak, A. M. (2006) Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration. Applied Physics LEtters. pp. 89-91.
