ChNU Repository

Login

Українська

Clear Cookie - decide language by browser settings

Items where Author is "Pu, B."

Group by: Item Type | No Grouping

Jump to: Article

Number of items: 1.

Article

Liu, Y. and Pu, B. and Gusak, A. M. (2020) Ultra-thin intermetallic compound formation in microbump technology by the control of a low Zn concentration in solder. Acta Materialia, Vol.12. pp. 1-7.

This list was generated on Tue Dec 10 02:10:10 2024 EET.

ChNU Repository is powered by EPrints 3 which is developed by the School of Electronics and Computer Science at the University of Southampton. More information and software credits.