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Gan, Z. and Gusak, A. M. and Shao, W. and Chen, Z. and Mhaisalkar, S.G. and Zaporozhets, T. and Tu, K. N. (2007) Analytical modeling of reservoir effect on electromigration in Cu interconnects. Journal of Materials Research, Т. 22 (№ 1). pp. 152-158.