Items where Author is "Meyer, M. A. M."

Vairagara, A. V. and Krishnamoorthy, A. and Tu, K. N. and Gusak, A. M. and Meyer, M. A. M. and Zschech, E. and Mhaisalkar, S. G. and Zschech, E. (2004) In situ observation of electromigration-induced void migration in dual-damascene Cu interconnect structures. Applied physics letters, Т. 85 (№ 13). pp. 2502-2505.