Елементи, в яких автор: "Liu, Y."

Стаття

Liu, Y., Гусак, А. М., Jing, S., Tu, K. N. (2022) Fast prediction of electromigration lifetime with modified mean-time-to-failure equation. Materials Letters, 325. с. 1-3.

Liu, Y., Pu, B., Gusak, A. M. (2020) Ultra-thin intermetallic compound formation in microbump technology by the control of a low Zn concentration in solder. Acta Materialia, Vol.12. с. 1-7.