Items where Author is "Jia-Juen, O."

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Hung-Che, L. and Shih-Chi, L. and Jia-Juen, O. and Dinh-Phuc, T. and Gusak, A. M. and Tu, K. N. and Chih, C. (2022) Evolution of interfacial voids in Cu-to-Cu joints. Materials Characterization, 190. pp. 2-11.

This list was generated on Mon Apr 22 15:38:25 2024 EEST.