Hodaj, F. and Gusak, A. M. and Liashenko, O. Yu. (2013) Possibility of a shape phase transition for solidifi cation of tin at scallop-like surfaces of Cu6Sn5. Philosophical Magazine Letters, Т. 93 (№ 3). pp. 166-173.
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Abstract
The possibility of solder-spreading transitions in solidification of solder at a rough rigid intermetallic surface is proven theoretically. Depending on the misorientation of scallops on the interface, one can observe a two-dimensional spreading transition over the scallops or a one-dimensional spreading transition along the triple-junction of two intermetallic compound scallops and liquid solder. The extent of undercooling can be determined not only by different interface energies, but by different angles between neighbouring scallops as well
| Item Type: | Article |
|---|---|
| Uncontrolled Keywords: | nucleation ; phase transformations ; wetting ; thermodynamics ; undercooling |
| Subjects: | Фізико-математичні науки |
| Divisions: | Навчально-науковий інститут інформаційних та освітніх технологій |
| Depositing User: | Наукова Бібліотека |
| Date Deposited: | 16 Apr 2020 19:03 |
| Last Modified: | 15 May 2023 13:11 |
| URI: | https://eprints.cdu.edu.ua/id/eprint/2138 |
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