Items where Author is "Pu, B."

Up a level
Export as [feed] Atom [feed] RSS 1.0 [feed] RSS 2.0
Group by: Item Type | No Grouping
Jump to: Article
Number of items: 1.


Liu, Y. and Pu, B. and Gusak, A. (2020) Ultra-thin intermetallic compound formation in microbump technology by the control of a low Zn concentration in solder. Acta Materialia, Vol.12. pp. 1-7.

This list was generated on Tue Dec 6 05:33:00 2022 EET.