Items where Author is "Pu, B."

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Article

Liu, Y. and Pu, B. and Gusak, A. (2020) Ultra-thin intermetallic compound formation in microbump technology by the control of a low Zn concentration in solder. Acta Materialia, Vol.12. pp. 1-7.

This list was generated on Sun Apr 18 08:54:23 2021 EEST.