Items where Author is "Liu, Y."

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Liu, Y. and Pu, B. and Gusak, A. (2020) Ultra-thin intermetallic compound formation in microbump technology by the control of a low Zn concentration in solder. Acta Materialia, Vol.12. pp. 1-7.

This list was generated on Fri Dec 2 11:52:57 2022 EET.