Application of the Critical Gradient Concept to First Phase Formation in Cu/Sn Nano-Multilayered Systems

Pasichnyy, M. O., Janczak-Rusch, J., Jeurgens, L. P. H., Liashenko, O. Yu., Gusak, A. M. (2015) Application of the Critical Gradient Concept to First Phase Formation in Cu/Sn Nano-Multilayered Systems. Euromat. с. 20-24.

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Резюме

Cu-Sn is one of the important systems for interconnects in microelectronics. Mechanical, electric and other properties of interconnect contact are determined mainly by the intermetallic phases appearing during reactions at the interface. For example, appearance of Cu3Sn1 phase at the joint interface leads to Kirkendall voiding and to degradation of interconnects contacts. And a question, how to escape or at least postpone the Cu3Sn1 phase formation remains extremely important especially for power electronics. Yet, many problems concerning kinetics of reaction, morphology of contact zone, mechanical properties of the reaction zone, remain unsolved.

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