Phase growth competition in solid/liquid reactions between copper or Cu3Sn compound and liquid tin-based solder

Liashenko, O. and Gusak, A. M. and Hodaj, F. (2014) Phase growth competition in solid/liquid reactions between copper or Cu3Sn compound and liquid tin-based solder. Springer Science+Business Media New York. pp. 1-9.

[img] Image
2014_JMS_paper.djvu

Download (214kB)

Abstract

Interfacial reaction between solid e-Cu3Sn compound and liquid Sn at 250°C is studied for the first time. The reaction product formed at the e-Cu3Sn/liquid Sn interface consists of the single g-Cu6Sn5 phase. The growth kinetics of the g phase formed at the incremental e/liquid Sn couple (e/g/Sn configuration) is compared to that of g phase formed at the classical Cu/liquid Sn couple (Cu/e/g/Sn configuration). The experimental method consists first in processing of intimate interfaces by dipping peaces of solid e-Cu3Sn compound and Cu in liquid Sn for 1 s at 250°C. Afterwards, isothermal holding of such preperformed couples for 10, 30, 120 and 480 min at 250°C are performed for both couples. A theoretical analysis of the growth kinetics of g phase and comparison of its growth in both configurations are performed.

Item Type: Article
Subjects: Фізико-математичні науки
Divisions: Навчально-науковий інститут інформаційних та освітніх технологій
Depositing User: Наукова Бібліотека
Date Deposited: 16 Apr 2020 18:33
Last Modified: 16 Apr 2020 18:33
URI: http://eprints.cdu.edu.ua/id/eprint/2097

Actions (login required)

View Item View Item