Phase growth competition in solid/liquid reactions between copper or Cu3Sn compound and liquid tin-based solder

Liashenko, O., Gusak, A. M., Hodaj, F. (2014) Phase growth competition in solid/liquid reactions between copper or Cu3Sn compound and liquid tin-based solder. Springer Science+Business Media New York. с. 1-9.

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Резюме

Interfacial reaction between solid e-Cu3Sn compound and liquid Sn at 250°C is studied for the first time. The reaction product formed at the e-Cu3Sn/liquid Sn interface consists of the single g-Cu6Sn5 phase. The growth kinetics of the g phase formed at the incremental e/liquid Sn couple (e/g/Sn configuration) is compared to that of g phase formed at the classical Cu/liquid Sn couple (Cu/e/g/Sn configuration). The experimental method consists first in processing of intimate interfaces by dipping peaces of solid e-Cu3Sn compound and Cu in liquid Sn for 1 s at 250°C. Afterwards, isothermal holding of such preperformed couples for 10, 30, 120 and 480 min at 250°C are performed for both couples. A theoretical analysis of the growth kinetics of g phase and comparison of its growth in both configurations are performed.

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