Cu3Sn suppression criterion for solid copper/molten tin reaction

Hodaj, F. and Liashenko, O. and Gusak, A. M. (2014) Cu3Sn suppression criterion for solid copper/molten tin reaction. Philosophical Magazine Letters. pp. 1-8.

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Abstract

The formation of Cu3Sn phase in the soldering reaction is believed to be harmful for the reliability of solder contacts on account of Kirkendall voiding in the compound. In this study, a criterion for the suppression of the growth of this phase by the fast growing scallop-like Cu6Sn5 compound is presented. The average thickness of the η-Cu6Sn5 phase above which the ε-Cu3Sn phase starts to grow as a continuous layer at the Cu/Cu6Sn5 interface during liquid Sn/solid Cu interaction has been evaluated from thermodynamic and kinetic considerations.

Item Type: Article
Uncontrolled Keywords: solid phase reactions ; diffusion ; thermodynamics ; interfaces ; soldering; phase competition
Subjects: Фізико-математичні науки
Divisions: Навчально-науковий інститут інформаційних та освітніх технологій
Depositing User: Наукова Бібліотека
Date Deposited: 16 Apr 2020 18:27
Last Modified: 16 Apr 2020 18:27
URI: http://eprints.cdu.edu.ua/id/eprint/2091

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